Apple are doing it again. Change for the sake of innovation?

Apple Insider have discovered a new patent submitted by Apple, which they appear to be intending to use to make headphone slots thinner, which of course would allow them to reduce the overall thickness of their phones.
Now while it may initially sound like a good idea, it is only on closer inspection of the design drawing that the main issue comes out and slaps you in the face. That flat face on the jack might well reduce the thickness by around 1mm, but it also means that the jack cannot swivel. Doesn’t seem like a deal breaker, but when you realise that the reason these 3.5mm headphone jacks work is because they can swivel to relieve stress on the cable, then you can see what is going to happen.
I have no doubt that we are going to see many stories about broken headphone cables within days of this feature going live on the next iPhone. And if it is indeed implemented then the ‘bendy iPhone’ which was an issue within days of the launch of the last iPhone will seem like a minor blip in comparison. Of course, Apple may have already found a workaround which negates this possibility, but there certainly doesn’t seem to be any mention of it in the patent submission. There is some discussion of ‘flexibility’ in some of the components, but I don’t see anything in these descriptions which would lead me to believe that Apple have resolved this.
You also have to wonder why they have gone with the ‘D’ shape? Why didn’t they just shave another 1mm off the other side as well? If it can’t move or swivel because of the ‘D’ shape, it’s unlikely that having another flat surface would create a bigger problem. In the world of making things smaller because you can, it would be logical to go all the way and get that 3.5mm down to 1.5mm. Perhaps they’ve tested it and found it didn’t work, or perhaps they just didn’t think of it?
Either way, like most new tech I’d wait a few weeks before throwing money at the next iPhone iteration. You might just save yourself a lot of hassle and headaches.